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HYG299R02024A

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HYG299R02024A
HYG299R02024A
Production process


Specification
Code HYG299R02024A Customer PN


Layer 2 Blind/Buried Via NO

Base Material FR4 TG130，CTI150 Unit Size(mm) 500.0000 X 13.0000
Board thickness 0.8mm Panle Size(mm) 500.0000
 X 252.0000
Min hole 0.5mm Pcs/Panle 1 X 18
Total Holes 4108 Copper OZ(finish) 2OZ Base Cu /
W/S(mil) / Min Hole Copper Thickness 20um

Outline Finish CNC+V-CUT Finish thickness tolerance +/-10%

Contour tolerance +/-0.13mm Surface Finishing


X-out / Solder Mask White

Special request mark
 Silkscreen White

ISO Certification

UL Certification

Application areas

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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